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An investigation of c-HiPIMS discharges during titanium depositionBARKER, Paul Michael; KONSTANTINIDIS, Stephanos; LEWIN, Erik et al.Surface & coatings technology. 2014, Vol 258, pp 631-638, issn 0257-8972, 8 p.Article

Metallic film deposition using a vacuum arc plasma source with a refractory anodeBEILIS, Isak I; BOXMAN, Raymond L.Surface & coatings technology. 2009, Vol 204, Num 6-7, pp 865-871, issn 0257-8972, 7 p.Conference Paper

Chromium and titanium film deposition using a hot refractory anode vacuum arc plasma sourceBEILIS, I. I; SHNAIDERMAN, A; BOXMAN, R. L et al.Surface & coatings technology. 2008, Vol 203, Num 5-7, pp 501-504, issn 0257-8972, 4 p.Conference Paper

Film deposition using 1-inch-sized HIPIMS system — Toward minimal fabrication semiconductor production systemYUKIMURA, Ken; OGISO, Hisato; NAKANO, Shizuka et al.Surface & coatings technology. 2014, Vol 250, pp 26-31, issn 0257-8972, 6 p.Conference Paper

Substrate hardness dependency on properties of Al2O3 thick films grown by aerosol depositionLEE, Dong-Won; KIM, Hyung-Jun; KIM, Yong-Nam et al.Surface & coatings technology. 2012, Vol 209, pp 160-168, issn 0257-8972, 9 p.Article

Evaluation, comparison and validation of deposition criteria for numerical simulation of slaggingWIELAND, Christoph; KREUTZKAM, Benjamin; BALAN, Gundula et al.Applied energy. 2012, Vol 93, pp 184-192, issn 0306-2619, 9 p.Article

Increasing the carbon deposition rate using sputter yield amplification upon serial magnetron co-sputteringSCHMIDT, Rüdiger M; RIES, Patrick; PFLUG, Andreas et al.Surface & coatings technology. 2014, Vol 252, pp 74-78, issn 0257-8972, 5 p.Article

Copper film deposition and anode temperature measurements in a vacuum arc with tungsten anodeBEILIS, I. I; SHNAIDERMAN, A; SHASHUFIN, A et al.Surface & coatings technology. 2007, Vol 202, Num 4-7, pp 925-930, issn 0257-8972, 6 p.Conference Paper

High rate deposition of highly stable a-Si:H films using multi-hollow discharges for thin films solar cellsNAKAMURA, William Makoto; MATSUZAKI, Hidefumi; SATO, Hiroshi et al.Surface & coatings technology. 2010, Vol 205, issn 0257-8972, S241-S245, SUP1Conference Paper

Effect of deposition pressure on the properties of DLC coatings deposited by bipolar-type PBII&DCHOI, Junho; NAKAO, Setsuo; IKEYAMA, Masami et al.Surface and interface analysis. 2008, Vol 40, Num 3-4, pp 806-809, issn 0142-2421, 4 p.Conference Paper

Influence of gas phase and surface reactions on plasma polymerizationGUIMOND, Sébastien; SCHÜTZ, Urs; HANSELMANN, Barbara et al.Surface & coatings technology. 2011, Vol 205, issn 0257-8972, S447-S450, SUP2Conference Paper

Modelling of sputtering yield amplification effect in reactive deposition of oxidesKUBART, T; NYBERG, T; PFLUG, A et al.Surface & coatings technology. 2010, Vol 204, Num 23, pp 3882-3886, issn 0257-8972, 5 p.Article

Study on crystalline to amorphous structure transition of Cr coatings by magnetron sputteringHONGTAO LI; BAILING JIANG; BO YANG et al.Applied surface science. 2011, Vol 258, Num 2, pp 935-939, issn 0169-4332, 5 p.Article

High-rate reactive deposition of transparent Si02 films containing low amount of Zr from molten magnetron targetMUSIL, Jindrich; SATAVA, Vaclav; BAROCH, Pavel et al.Thin solid films. 2010, Vol 519, Num 2, pp 775-777, issn 0040-6090, 3 p.Article

Macroscopic plasma-chemical approach to plasma polymerization of HMDSO and CH4HEGEMANN, D; SCHüTZ, U; FISCHER, A et al.Surface & coatings technology. 2005, Vol 200, Num 1-4, pp 458-462, issn 0257-8972, 5 p.Conference Paper

Low coverage Si(1 1 1)√7 × √3-In reconstruction: Deposition rate effectSKISCIM, Marta; BILINSKA, Sylwia; IDCZAK, Karolina et al.Applied surface science. 2014, Vol 304, pp 103-106, issn 0169-4332, 4 p.Conference Paper

Effect of substrate temperature and deposition rate on the morphology and optical properties of Ti filmsEINOLLAHZADEH-SAMADI, M; DARIANI, R. S.Applied surface science. 2013, Vol 280, pp 263-267, issn 0169-4332, 5 p.Article

Influence of pressure on an asymmetric, radio frequency discharge with methaneHEGEMANN, D.Thin solid films. 2006, Vol 515, Num 4, pp 2173-2178, issn 0040-6090, 6 p.Article

Copper film deposition rates by a hot refractory anode vacuum arc and magnetically filtered vacuum arcSHASHURIN, A; BEILIS, I. I; SIVAN, Y et al.Surface & coatings technology. 2006, Vol 201, Num 7, pp 4145-4151, issn 0257-8972, 7 p.Conference Paper

Zirconium vacuum arc operation in a mixture of Ar and 02 gases: Ar effect on the arcing characteristics, deposition rate and coating propertiesGOLDBERG, O; GOLDENBERG, E; ZHITOMIRSKY, V. N et al.Surface & coatings technology. 2012, Vol 206, Num 21, pp 4417-4424, issn 0257-8972, 8 p.Article

Process stabilization and enhancement of deposition rate during reactive high power pulsed magnetron sputtering of zirconium oxideSARAKINOS, K; ALAMI, J; KLEVER, C et al.Surface & coatings technology. 2008, Vol 202, Num 20, pp 5033-5035, issn 0257-8972, 3 p.Article

Maximum rate of the cathodic reaction in electroless copper deposition = Vitesse maximale de la réaction cathodique dans le dépôt chimique de cuivreVITKAVAGE, D; PAUNOVIC, M.Plating and surface finishing. 1983, Vol 70, Num 4, pp 48-50, issn 0360-3164Article

High-rate welds need more current, a different gas, and gun cooling = Le soudage à grande vitesse nécessite une intensité plus forte, un gaz différent et un refroidissement de la torcheBIRCHFIELD, J. R.Welding design & fabrication. 1985, Vol 58, Num 6, pp 32-37, issn 0043-2253Article

High deposition rate of amorphous carbon film using a magnetically driven shunting arc dischargeYUKIMURA, Ken; KUMAGAI, Motoya; TAKAKI, Koichi et al.Surface & coatings technology. 2005, Vol 196, Num 1-3, pp 203-206, issn 0257-8972, 4 p.Conference Paper

Ion redistribution near the polar groups in the Langmuir wetting processKOVALCHUK, V. I; ZHOLKOVSKIY, E. K; BONDARENKO, M. P et al.The Journal of adhesion (Print). 2004, Vol 80, Num 9, pp 851-870, issn 0021-8464, 20 p.Article

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